简介:
Solder packaging
In order to meet the diversified production needs of customers, Bailin electronics has developed a variety of packaging methods suitable for manual welding and automatic pasting. Including conventional bottled, boxed, SMD tape packaging, waffle box packaging, blue film packaging and tape packaging, which is convenient for automatic unpacking and picking of mechanical equipment. Cooperate with the automatic mounting process for mounting.
All product packaging forms are subject to vacuum treatment to protect the solder chips from oxidation damage during transportation and storage.
Application scenario
1. Chip eutectic mounting