Welcome~Shanwei Bolin material Co., Ltd
English
中文
Phone：
0660-6782773
Toggle navigation
导航菜单
Home
About us
About us
Process
Contact us
Honor
Products
Alloy composition table + gradient
Precious metal series
Pre coated flux series
Complex shape series
General civil series
Preset solder device
Thin film solder
News
Company news
Industry news
Discuss
Technical information
Academic papers
Feedback
Contact us
Home
>
News
> Study on brazing and deformation of Cu MoCu Cu (CPC) material and Al2O3 ceramics for electronic packaging
Academic papers
Study on brazing and deformation of Cu MoCu Cu (CPC) material and Al2O3 ceramics for electronic packaging
上一个:No previous
下一个:
Effect of sb on Au Ge eutectic solder alloy
Relevant information
Study on brazing and deformation of Cu MoCu Cu (CPC) material and Al2O3 ceramics for electronic packaging
2022-04-23
Congratulations to the general manager of our company on being rated as a high-level excellent talent by Haifeng County Government
2015-01-05
Conflict minerals policy statement
2021-09-15
Panoramic analysis of lidar industry chain
2022-04-18
Navigation
Company news
Industry news
technical information
Academic papers
News
Study on brazing and def
Congratulations to the g
Conflict minerals policy
Panoramic analysis of li
Contact us
Address: building A-B, No. 23, meibei Avenue, Meilong Town, Haifeng County, Shanwei City, Guangdong Province
Tel: 0660-6782773
Email: qisi@bolinmaterial.com
Mobile: 18688076449
Home
Phone
Products
Top
Advs
Weboss
Tonv
phpweb
