简介：相较于传统的焊锡丝和焊膏等焊料给料手段，预成型焊料具有焊料量精准、一致性高、空洞率低和简化工艺操作等优点。特别是对于一些特殊的微组装操作场景，合适形状的预成型焊料更是具有不可替代的辅助作用。 随着电子封装集成度、复杂度和可靠性要求越来越高，对于预成型焊料的成型提出了越来越高的要求。 BOLIN®栢林电子将材料成型作为核心技术之一。经过十余年的发展进步，已形成以常规预成型焊料大规模稳定量产为基础，复杂高难度焊片多样发展。为客户的量产产品和前沿研发项目提供稳定的焊料支持。 你天马行空的创意，栢林可以帮你实现！
With the improvement of integration and complexity of electronic packaging design, preformed solder is required to be made into various complex shapes; At the same time, in order to improve the packaging efficiency, sometimes some simple shapes are also required to be made into complex arrays to meet the requirements of mass production.
BOLIN ® Bailin electronic integrates various metal forming methods to ensure the high-precision presentation of various complex difficulties.
