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  • Panoramic analysis of li
  • Panoramic analysis of li
  • Panoramic analysis of li
Indium in based solder

Indium in based solder

简介:以金锡为代表的贵金属钎料在工业领域有着广泛的应用。该类钎料具有稳定的化学稳定性,良好的耐腐蚀性,良好的机械强度,和良好的浸润性,被广泛应用于高性能和高可靠性电子封装和钎焊连接领域。 BOLIN®栢林电子提供的贵金属焊料包括了金(Au)基系列、钯(Pd)基系列和银(Ag)基系列。

Indium in has a low melting point (157 ℃), and can form a series of eutectic solders with low melting point with Sn, Pb, Ag and other elements, which can avoid the influence of high temperature factors on the products during packaging and welding. Indium in based solders have high corrosion resistance to alkaline media and good wetting ability to metals and non metals. The formed solder joints have the advantages of low resistance and high plasticity, and can be used for matching packaging of materials with different thermal expansion coefficients. Therefore, indium in based solder is mainly used in the packaging of electric vacuum devices, glass, ceramics and low-temperature superconducting devices. Pure indium in and indium in based alloy solders have the characteristics of excellent thermal conductivity, low melting point, excellent softness and ductility. They are commonly used as connecting materials and heat conducting materials for ceramic components to PCB.
Indium in based solder has good physical properties, good fatigue resistance, mechanical strength and reliable tensile strength. It has high corrosion resistance to alkaline and salt media and is suitable for welding chlor alkali industrial equipment. At the same time, it has high conductivity. Indium in based solder is close to Sn Pb alloy and has higher conductivity, which can avoid the loss of electrical signal on the solder joint and meet the requirements of electronic connection. It also has good compatibility. In the process of using indium in based solder, it has good brazing performance with copper, tin, silver, gold, nickel and other coatings of PCB pad and component pin coatings. In addition, it can be compatible with different types of flux. Indium solder can prevent gold embrittlement. When welding gold-plated products, if tin based solder is used, the gold of gold-plated components will be absorbed, and brittle metal compounds will be formed; In this case, it is generally recommended to use indium in based solder, which can prevent the loss and penetration of gold and enhance the reliability of solder joints. Due to its good wettability with non-metals, indium solder can be used in the welding of glass products, ceramic products, quartz products and ceramic products in electronics, low-temperature physics and vacuum systems. Its wide melting point area can produce different types of indium in based alloy products with melting points ranging from tens of degrees to more than 300 degrees according to different proportions, which can meet the needs of different fields.



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