Home > Products > Ultra thin solder
  • Ultra thin solder
Ultra thin solder

Ultra thin solder

简介:相较于传统的焊锡丝和焊膏等焊料给料手段,预成型焊料具有焊料量精准、一致性高、空洞率低和简化工艺操作等优点。特别是对于一些特殊的微组装操作场景,合适形状的预成型焊料更是具有不可替代的辅助作用。 随着电子封装集成度、复杂度和可靠性要求越来越高,对于预成型焊料的成型提出了越来越高的要求。 BOLIN®栢林电子将材料成型作为核心技术之一。经过十余年的发展进步,已形成以常规预成型焊料大规模稳定量产为基础,复杂高难度焊片多样发展。为客户的量产产品和前沿研发项目提供稳定的焊料支持。 你天马行空的创意,栢林可以帮你实现!

With the decrease of package size and the increase of package density, chip thermal management has become one of the key factors affecting the performance and life of the system. The cumulative effect of thermal energy will greatly limit the life and efficiency of the chip with the increase of time.
Bailin electronics innovates the alloy processing technology, which limits the lower limit of thickness that common solder can reach, and provides customers with a wider range of solder thickness selection for assembly process, thus bringing greater freedom to the design of packaging system.
Typical ultra thin solders provided by Bailin are as follows:

Previous:Limit size solder Next:No next


Contact us

Address: building A-B, No. 23, meibei Avenue, Meilong Town, Haifeng County, Shanwei City, Guangdong Province
Tel: 0660-6782773
Email: qisi@bolinmaterial.com
Mobile: 18688076449
Advs Weboss Tonv phpweb