简介：金属薄膜技术广泛用于各种功能材料的表面改性，如增加硬度、增强耐磨，增加催化，改变光学磁学特性等，广泛用于机械、电子、光学等各个行业。 合金 BOLIN®栢林电子掌握先进的合金熔炼和成型工艺，为合金薄膜材料提供有力辅助。
Through precise operation, the ultra-thin gold tin is preset on the devices to be welded (heat sink, etc.) to facilitate the operation of the next process. The ultra-thin solder preset can effectively reduce the heat dissipation resistance of the chip and improve the welding quality and efficiency.
