简介：金属薄膜技术广泛用于各种功能材料的表面改性，如增加硬度、增强耐磨，增加催化，改变光学磁学特性等，广泛用于机械、电子、光学等各个行业。 合金 BOLIN®栢林电子掌握先进的合金熔炼和成型工艺，为合金薄膜材料提供有力辅助。
The principle of traditional alloy film technology (such as evaporation, sputtering, electroplating, etc.) is the cumulative combination of alloy atoms layer by layer, and the thickness of the alloy layer is often in the nanometer scale; However, the thin alloy processed by traditional machining is often difficult to process to the micron level because of the existence of brittle phase analyzed by the alloy. The thickness obtained is generally in the unit of wire (10um).
BOLIN ® Bailin electronics creatively combines a variety of alloy forming methods to fill the gap from nano scale to micron scale of alloy wave thin material. It is suitable for all kinds of chip welding scenes with high requirements.
