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Capsule solder

Capsule solder

Capsule (also known as vacuum release box, gel Pak box), the sample can be released from the gel by applying vacuum on the tray, so it can be easily removed without prying or applying force. It was first used for chip transfer, and then expanded to other small electronic assemblies such as preformed solder chips, with good cleanliness.
Choosing the appropriate grid size depends on the X and Y dimensions of the device To optimize unloading performance, we provide a variety of mesh geometries (16 / 33 / 76 / 103 / 137 and 200).

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