Waffle box packaging allocates independent space to each micro solder chip, which is conducive to position fixation and collision protection during transportation. Open the package in the customer's workshop and assemble it in batch in the automation equipment. Through visual recognition and the matching of suction head, the micro solder can be accurately picked up and placed in the area to be welded.
Waffle box solder is especially suitable for batch packaging of gold tin solder chips with large length width ratio and thin thickness.
