Component name: preset Gold Tin substrate / base / heat sink
Solder type: AuSn, Auge and oth
Substrate type: package substrate / base (nickel gold surface)
Substrate material: ceramic, 4J29 (Kovar), 4J42, DBC, DPC
Application & Features
Chip bonding of microelectronic packaging (brazing process)
Bonding chip on ceramic heat sink or base
Bonding chip on metal heat sink
